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Unmatched Thermal Conductivity:
- BeO ceramics exhibit thermal conductance close to that of silver and red copper, far surpassing alumina substrates.
- Maximum thermal conductivity can reach up to 280 W/m.K, making it ideal for high-power applications.
High Electrical Resistance: Offers substantial electrical resistance, essential for reliable electronic applications.
Puncture Strength and Low Loss at High Frequencies: Excellent puncture strength and low dielectric loss, beneficial for high-frequency applications.
Mechanical Strength and Thermal Shock Resistance: Robust mechanical strength paired with exceptional thermal shock resistance ensures durability in demanding environments.
Chemical Inertia: Resistant to chemical attacks, enhancing its longevity and performance in various applications.
Applications: High-Power, Large-Scale Integrated Circuits (ICs), Electrical Packages, Thermoelectric Coolers (TEC), Hybrid Integrated Circuits (HIC), Printed Circuit Boards (PCBs), Aerospace and Telecommunications, Satellite Components, etc.
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High Hardness and Wear Resistance: SiC ceramics have a hardness of 9.2 on the Mohs scale, making them highly resistant to abrasion and wear.
High Thermal Conductivity: SiC has excellent thermal conductivity, allowing efficient heat dissipation in high-temperature environments.
Low Thermal Expansion: SiC exhibits low thermal expansion, ensuring dimensional stability under temperature fluctuations.
High Temperature Strength: SiC ceramics maintain their strength at elevated temperatures, making them suitable for high-temperature applications.
Chemical Inertness: Resistant to chemical attack by acids, alkalis, and molten salts, SiC ceramics are ideal for corrosive environments.
Electrical Properties: Depending on the doping and manufacturing process, SiC can exhibit semiconductor properties.
Applications: Aerospace and Defense, Electronics, Mechanical Seals and Bearings, Heat Exchangers, Kiln Furniture, Chemical Processing, etc.
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High Ruggedness: Robust construction minimizes the possibility of outgassing.
Nickel Plating: Ensures durability without blistering.
Versatility: Suitable for various applications requiring high thermal and electrical performance.
Applications: Wire Bonding Platforms, Microwave PCBs, Thermoelectric Coolers (TEC) for Lasers, Hybrid Integrated Circuits (HIC) for Automotive, High-Power Semiconductor Modules, Hermetic Electrical Packaging, etc.
